Ultra-Flat 6" Silicon Wafers

Ultra-Flat 6" diameter Silicon Wafer for demanding substrate studies. The 6" ultra-flat silicon wafer is shipped in a 6" wafer carrier.

Also available as 5 x 5mm, 5 x 7mm, 10 x10mm stealth-diced dies in Gel-Pak® boxes. Stealth dicing eliminates edge-chipping and cutting debris associated with saw dicing, providing the cleanest, most uniform product possible. All products are packed in class 10 clean room conditions.

Properties for 6" (150mm) Ultra-Flat Wafer:

1. Orientation: <100>
2. Type: P / Dopant: Boron
3. Grade: Prime / CZ Virgin
4. Resistivity: 1-10 Ohm/cm
5. Thickness: 650 - 700µm
6. TTV: ≤1.5µm
7. Warp: ≤30µm / Bow: ≤30µm
8. Particles: ≤30@≥0.2µm
9. Front surface: Polished
10. Back Surface: Etched
11. Flat: 1 per SEMI Standard (flat length 57.5 ±2.5mm)
12. Size: 6" (150mm) diameter wafer or 5 x 5mm, 5 x 7mm or 10 x 10mm diced chips
13. Roughness: Typical 2-3 Å (by AFM measurement)

21610-6 - Ø6" Ultra-Flat Silicon Wafer, Type <100>, each

21610-55 - 5 x 5mm stealth-diced Ultra-Flat Wafer, Type <100>, in a Gel-Pak® box, box/25

21610-57 - 5 x 7mm stealth-diced Ultra-Flat Wafer, Type <100>, in a Gel-Pak® box, box/18

21610-510 - 10 x 10mm stealth-diced Ultra-Flat Wafer, Type <100>, in a Gel-Pak® box, box/6